RESPONSIVE DESIGN
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SUPER FEATURES
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DRAG AND DROP
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We are focusing on:
Experimental and theoretical research of surface treatment methods with charged particles and their influence on mechanical, structural and tribological material properties.
Ion implantation and thin film deposition
We are utilizing the physical vapor deposition (PVD) technique to deposit thin film layers onto a substrate. The PVD process involves the vaporization of a target material via sputtering, wherein high-energy argon ions bombard the target, causing the ejection of its atoms. These vaporized atoms subsequently condense on the substrate surface, leading to the formation of a thin film. The PVD process is performed in a vacuum chamber to minimize contamination. This technique allows us to deposit various materials, including metals, ceramics, or polymers.
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X-Ray powder and polycrystalline diffraction
Phase analysis, crystallite sizes, residual stress measurement
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Use of lymphocytes of hypersensitive patients for preclinical testing of advanced titanium-based materials modified by ion beam
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Applications of energy beams in solid state physics
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Ion implantation
We perform experiments involving ion implantation of nitrogen, oxygen, and argon to study their impact on the materials surface properties. Ion implantation is a technique that utilizes bombardment of a target material with ion particles (dopants) to modify its properties, such as electrical and thermal conductivity, corrosion resistance, wettability, wear resistance, hardness, or biocompatibility. The majority of the implanted ions (at perpendicular incidence) penetrate below the target surface and attain equilibrium state, while a minor fraction is backscattered. Additionally, some target atoms are sputtered from the surface. The resulting alterations in material properties can be adjusted by varying implantation parameters, such as ion fluence (the number of ions impacting the target per unit area during the total implantation time), ion type, ion energy, ion incidence angle, target state and composition, target temperature, and target crystallographic orientation.
Thin film deposition
Physical vapor deposition
We are utilizing the physical vapor deposition (PVD) technique to deposit thin film layers onto a substrate. The PVD process involves the vaporization of a target material via sputtering, wherein high-energy argon ions bombard the target, causing the ejection of its atoms. These vaporized atoms subsequently condense on the substrate surface, leading to the formation of a thin film. The PVD process is performed in a vacuum chamber to minimize contamination. This technique allows us to deposit various materials, including metals, ceramics, or polymers.
Material characterization
X-rays techniques
We employ X-ray based techniques such as X-ray diffraction (XRD), small angle X-ray scattering (SAXS), and micro computed tomography (micro-CT) to characterize materials crystal structure, microstructure, or texture. XRD involves scattering X-rays off atoms in a crystalline material and analyzing the resulting diffraction pattern. Intensities, angles at which the diffracted beams are observed (Bragg angles), and peak widths carry a footprint on the structural and microstructural information of the material. The major XRD applications include qualitative and quantitative phase analysis, estimation of crystallite sizes, evaluation of residual stresses, and determination of lattice parameters. SAXS is a method that utilizes detection of X-rays scattered at low angles to investigate the microscture and nanosctructure of materials. It is commonly used to determine the size and shape distribution of nanoparticles, macromolecules, or pores. Micro-CT is a non-destructive imaging technique used to create high-resolution 3D images of the internal microstructure of materials, allowing to analyze its features with micro dimensions, such as pores, inclusions, and cracks.
Surface modification
Ion implantation
We are utilizing the physical vapor deposition (PVD) technique to deposit thin film layers onto a substrate. The PVD process involves the vaporization of a target material via sputtering, wherein high-energy argon ions bombard the target, causing the ejection of its atoms. These vaporized atoms subsequently condense on the substrate surface, leading to the formation of a thin film. The PVD process is performed in a vacuum chamber to minimize contamination. This technique allows us to deposit various materials, including metals, ceramics, or polymers.
We are utilizing the physical vapor deposition (PVD) technique to deposit thin film layers onto a substrate. The PVD process involves the vaporization of a target material via sputtering, wherein high-energy argon ions bombard the target, causing the ejection of its atoms. These vaporized atoms subsequently condense on the substrate surface, leading to the formation of a thin film. The PVD process is performed in a vacuum chamber to minimize contamination. This technique allows us to deposit various materials, including metals, ceramics, or polymers.
Our philosophy
Protective Preventative Maintenance
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About us
Protective Preventative Maintenance
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